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E&G Technology Partners
Peter Elenius, Elenius, Tom Goodman, Thomas Goodman, Goodman, Flip Chip, Wafer Level Package, WLP, bumping, consultant, consulting, business development, marketing, semiconductor, expert, Ultra CSP, Flip Chip Technologies, new technology, technology, technologies, Elenius, Goodman, Flip Chip, wlp, new technology, expert witness, IC Packaging, Advanced IC Packaging, comprehensive business plans, business plan, funding, funds, equity
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