EV Group (EVG) 3D Interconnect - Bonder - Aligner - Coater

Description: EV Group (EVG)  3D Interconnect, EVG GEMINI: the only field-proven automated production wafer bonder for 3D integration in the semiconductor industry designed for processing wafer sizes up to 300mm with maximum flexibility. Void-free bonding with sub-micron to micron-level alignment accuracy, Easy conversion to different wafer sizes, Modular design with a minimized footprint;

Keywords: 3D Interconnect, 3D-IC, EVG, EV Group, wafer bonder, wafer bonding, bonder, bonding, semiconductor process equipment, MEMS, Advanced Packaging, aligner, mask aligner

Tags: interconnect, group, homepage, bonder, evg, aligner, coater, 3d, wafer, gemini®, imprint, liti, contact, cea, alliance, minatec, bonding, semiconductor, micron, sizes, packaging, mems, equipment, advanced, processing, automated, production, mask, process, high, key, solutions, lithography, design, minimized, modular, footprint, gemini, maximum, integration,

3d-interconnect.com

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